Kirin 985 to be mass-produced with 5G modems

Last month we heard rumors that the Huawei Mate 30 could be the first smartphone with a chipset built on the EUV process, and now media representatives in Taiwan confirm the information. Not only that, but Huawei's chip manufacturer HiSilicon will implement 5G modem in all the chips, effectively making all future Huawei flagships 5G-compatible. The new processor will be manufactured using the FC-PoP method (FlipChip Package-on-Package), which allows vertical stacking of transistors. Combined with the Extreme UltraViolet process, the transistor density will be increased by 20% -...

from GSMArena.com - Latest articles http://bit.ly/2XTiaWt

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Oppo A55s Renders Leaks Online; Shows Hole-Punch Display, Dual Rear Cameras

Oppo A55s renders have surfaced online. Leaked renders give a glimpse of the slim design and rectangular camera module of the upcoming smartphone. The handset is seen in Green and Blue colour options, featuring a hole-punch display and two cameras on the back. from Gadgets 360 https://bit.ly/3ciilUN

Google getting a new AirDrop-like feature called as Fast Share for file transfer

via Firstpost Tech Latest News http://bit.ly/2XCnSj7

Humankind generates upto 100 times as much CO2 as venting from volcanoes each year: Report

via Firstpost Tech Latest News http://bit.ly/2mMIpB4

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