Qualcomm is said to be working on a new generation of smart wearable chipsets in the Snapdragon Wear family and WinFuture.de is bringing us our first set of details on them. The Snapdragon Wear 5100 and 5100+ are said to be in the works bringing significant performance gains over the current Wear 4100 generation. Both new chips will be fabbed on Samsung Semiconductor’s 4nm process. Snapdragon Wear 5100 uses a molded laser package (MLP) that separates SoC and power management IC. Wear 5100+ will use a molded embedded package (MEP) which has the SoC and PMIC integrated in the same...
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