MediaTek Dimensity 7200 Octa-Core SoC With Support for Sub-6GHz 5G, 200-Megapixel Cameras Launched: Details

MediaTek Dimensity 7200 is the firm's first chipset in the new Dimensity 7000 series. This chip also uses the same TSMC 4nm second-generation process as the Dimensity 9200 chips. The Dimensity 7200 will power 5G devices that will hit the market in the first quarter of 2023, according to the company.

from Gadgets 360 https://bit.ly/3E8ggbZ

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Oppo A55s Renders Leaks Online; Shows Hole-Punch Display, Dual Rear Cameras

Oppo A55s renders have surfaced online. Leaked renders give a glimpse of the slim design and rectangular camera module of the upcoming smartphone. The handset is seen in Green and Blue colour options, featuring a hole-punch display and two cameras on the back. from Gadgets 360 https://bit.ly/3ciilUN

Google getting a new AirDrop-like feature called as Fast Share for file transfer

via Firstpost Tech Latest News http://bit.ly/2XCnSj7

Humankind generates upto 100 times as much CO2 as venting from volcanoes each year: Report

via Firstpost Tech Latest News http://bit.ly/2mMIpB4

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