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Micron unveils its UFS 4.0 storage tech it's twice as fast as previous-gen storage

Micron announced its UFS 4.0 mobile storage solution and revealed that it has already shipped qualification samples to “select global smartphone manufacturers and chipset vendors”. The new tech will be used to manufacture storage in 256GB, 512GB and 1TB capacities. High-volume production will begin in the second half of this year, so it will be a while before the first phones with Micron UFS 4.0 storage arrive. This storage is built on 232-layer TLC flash (triple-level cells, i.e. storing 3 bits per cell). According to the company, its six-plane NAND architecture enables higher...



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